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Effects Of Interface Area Density And Solid Solution On The Microhardness Of Cu-nb Microcomposite Wires

Permalink: http://purl.flvc.org/fsu/fd/FSU_libsubv1_wos_000462420900008
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Deng, L., Liu, Z., Wang, B., Han, K., & Xiang, H. Effects Of Interface Area Density And Solid Solution On The Microhardness Of Cu-nb Microcomposite Wires. Materials Characterization. Retrieved from http://purl.flvc.org/fsu/fd/FSU_libsubv1_wos_000462420900008
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Full Title

Effects Of Interface Area Density And Solid Solution On The Microhardness Of Cu-nb Microcomposite Wires

Names

Deng, Liping (author)
Liu, Zhifeng (author)
Wang, Bingshu (author)
Han, Ke (author)
Xiang, Hongliang (author)

Format

journal article
text

Date Issued

Mon Apr 01 00:00:00 ED

Abstract

Cu-Nb microcomposite wires drawn to different strain values were studied by means of scanning electron microscopy and transmission electron microscopy. The Cu and Nb near the interfaces show a typical Kurdjumov-Sachs relationship with a deviation angle of 12 degrees. This deviation accommodates internal stresses and slip discontinuity between Cu and Nb. The dislocations are mainly stored around the interface near the Cu matrix. Lattice distortion occurred near the interfaces, where Nb is believed to mix into Cu matrix. Microhardness is affected by interface area density as well as by strain-induced lattice distortion, which can produce a supersaturated solid solution.

Publication Note

The publisher's version of record is available at https://doi.org/10.1016/j.matchar.2019.02.002

Keywords

behavior, electrical-conductivity, mechanical-properties, thermal-stability, composite wires, copper, Cu-Nb microcomposite wires, high-strength, Interface, Microhardness, microstructure evolution, nanocomposite, niobium, Solid solution

DOI URL

https://doi.org/10.1016/j.matchar.2019.02.002

Identifier

FSU_libsubv1_wos_000462420900008
10.1016/j.matchar.2019.02.002

Language

English

Choose the citation style.
Deng, L., Liu, Z., Wang, B., Han, K., & Xiang, H. Effects Of Interface Area Density And Solid Solution On The Microhardness Of Cu-nb Microcomposite Wires. Materials Characterization. Retrieved from http://purl.flvc.org/fsu/fd/FSU_libsubv1_wos_000462420900008

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